The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
New Equipment | Assembly Services
K & F Electronics Website: https://circuitboards.com/ Email to send Gerber files and or BOM: info@circuitboards.com Phone: 888-722-5310 Assembler and Manufactuer of Printed Circuit Boards (PCB) K & F Electronics has the capability to produce a
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
Surface Mount Technology Services Siemens Siplace SMT Line Philips Topaz Line Philips Comet Line BGA Inspection and Repair Through Hole Assembly DIP Insertion Component sequencing Radial lead insertion Axial lead insertion Square Wire Insertion F
Laser cut stencils c/w Electro-Polished (mirrored finish) Multi Step Stencils Rework mini stencils Surface Mount Transport Plates Metal Squeegee Blades and Blade Assemblies Ball Grid Array (BGA) Re-Ball Fixtures Photo Plotting Electro - Polishing Fra
We supply OEM and ODM services for PCBA 1)Surface-mounting technology (SMT) and Through –hole/DIP; 2)0201,0402 placement; 3)BGA,CSP,QFP; 4)Burning test ; 5)Full in house design and rapid prototyping for customer; 6)High density interconnected board p
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Tape and Reel Services
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
