New Equipment | Assembly Services
We are Professional in PCB Manufacturing, PCB Fabrication, PCB Making! Hitech Circuits Co., Limited – Experienced PCB manufacturer from China. Our PCB manufacturing services will allow you to be the most competitive player in your market. Please che
Materials: FR-4 Layer count: 8 layers with blind/buried VIAs Min. VIAs: 10 mil Min. line: 5 mil Application: Printing controller Finishing: HAL
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
New Equipment | Assembly Services
10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt
Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
This 26-layer Stator board features 7 ounce layers (182oz total), and ENIG finish and Blind and Buried Vias.
1. FR-4 material, 1 oz copper finished 2. 6-12 layers, 5mm thick board 3. Green solder mask /white silk screen. 4. Blind/buried vias required. 5. Hot air level Pb free 6. Application: motor, medical equipment, industrial products.
