When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Solder Paste Stencils
SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Durostone® Solder pallets Durostone® Solder pallets - perfectly machined A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave sold
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
The Solder-Saver offers companies that use wave soldering the opportunity to instantly recycle dross created in the wave solder pot, thereby saving up to 50 percent in new solder bar purchases. It can be used with leaded, lead-free or unleaded wave s
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture wave solder carriers for open aperture and selective soldering process. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
New Equipment | Fabrication Services
Material: FR-4 Board thickness: 2.4mm Copper thickness: 140um/4oz Surface finishing: Immersion Gold (ENIG) Solder mask: blue, green, yellow, white, red, black, purple Application: UPS, power supply, convertor, motor For your board, feel free t