New SMT Equipment: board density (Page 8 of 127)

STACI

New Equipment |  

As a Buyer for a leading electronics manufacturer or a Design Engineer or an OEM manufacturer, your challenge is to find components to be incorporated in your end product at the most competitive pricing and as quickly as possible with the highest qua

STACI

Microvia Laser Drilling Services

Microvia Laser Drilling Services

New Equipment | Other

MLT provides microvia laser drilling services for both rigid and flexible circuit board manufacturers.  MLT is a leader in HDI drilling and design consulting to minimize drilling costs.  All IPC high density microvia types are supported in most any s

Micron Laser Technology

DM64x MM (Mini Module)

DM64x MM (Mini Module)

New Equipment |  

eInfochips DM64x MM is a low cost, credit card sized rapid prototyping board for IP Set-top box, Video Surveillance Systems, IP Video Phone, Video Conference Systems, IP enabled Video Recorders, Home Multi-media Gateway applications based on the TI D

eInfochips ltd.

Ceramic Circuit Board With LED Heat Dissipation

Ceramic Circuit Board With LED Heat Dissipation

New Equipment | IC Packaging

Owing to the our immense experience and understanding in this particular market, we are Manufacturing and Supplying an excellent variety of Ceramic Circuit Board With Led Heat Dissipation And Long Service Life from Wuhan, Hubei, China. High bonding s

Folysky Technology(Wuhan)Co.,Ltd

PCB, printed circuit board, printed wiring board, rigid PCB, Multilayer PCB, Multilayer printed circuit board, Quick turn PCB prototype, Rapid Board P

PCB, printed circuit board, printed wiring board, rigid PCB, Multilayer PCB, Multilayer printed circuit board, Quick turn PCB prototype, Rapid Board P

New Equipment | Assembly Services

Technical requirements: Material: FR-4 Layer: 2 layer Thickness of cooper: 1/1 Oz Thickness of board: 1.6MM Surface finish: HASL LF Min. hole size: 0.25mm Min.line width: 0.15mm Min.line space: 0.15mm Contact way: Mail: sales(at)hitechpcb.com www.h

Hitech Circuits PCB Co., Limited

GE IC694ALG392

GE IC694ALG392

New Equipment | Industrial Automation

General Electric  GIVEN YOUR BEST ! PLEASES mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 General Electric Company is an Americanmultinati

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Virtual Panel Tooling

Virtual Panel Tooling

New Equipment | Software

Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate

ASM Assembly Systems (DEK)

Heller 1809 Mark III SMT Reflow Oven

Heller 1809 Mark III SMT Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III SMT Reflow Oven Product description: Heller 1809 Mark III SMT Reflow Oven Heller 1809 Mark III SMT Reflow Oven Specifications: These workhorses provid

Flasonsmt Co.,ltd

Heller 1707 Mark III SMT Reflow Oven

Heller 1707 Mark III SMT Reflow Oven

New Equipment | Reflow

Heller 1707 Mark III SMT Reflow Oven SMT Reflow Oven Reflow Oven Heller 1707 Mark III SMT Reflow Oven Product description: Heller 1707 Mark III SMT Reflow Oven Heller 1707 Mark III SMT Reflow Oven Specifications: These workhorses provid

Flasonsmt Co.,ltd

Heller 1809 Mark III SMT Reflow Oven

Heller 1809 Mark III SMT Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III SMT Reflow Oven Heller 1809 Mark III Product description: Heller 1809 Mark III SMT Reflow Oven  INQUIRY Heller 1809 Mark III SMT Reflow Oven P

Flason Electronic Co.,limited


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