Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Low Cost Punch For Singulation Small Tab Routed Panels N200 singulates one tab at a time with upper and lower pinch blades. Singulate curve routed and odd shaped boards. Top and bottom knife set cuts tabs cleanly. Minimal stress on PCB. Toolin
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
Fancort offers the widest selection of depaneling machines for pre-scored and routed boards from any one company. Our machines are all benchtop, varying in throughput, cost, and stress level. Why select Fancort as your depaneling vendor? More cho
New Equipment | Solder Materials
A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices. This solder has
When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter
V groove pcb separator machine specification: Size:780 X 460X 560mm Machine Weight: 55Kg Minimize thickness: 0.6-3.5mm Minimize Speed: 100/200/300/500mm/s Features: 1. Separate pre-scored PCB assembly without stress on either PCB or componen
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Ensuring that electronics products function as they are designed to is just one piece of the materials solution Henkel delivers. Protecting printed circuit boards and electronic assemblies from thermal cycling and adverse environmental conditions is
