New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.
New Equipment | Assembly Services
KULICKE & SOFFA 1419-3- WIRE BONDER PART MACHINE
High Speed, Large Area (12in x 6in.) Ball bonder with Continuous Bonding Technology.
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
