New SMT Equipment: bonder catalog (Page 1 of 3)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

I.C.T ( Dongguan ICT Technology Co., Ltd. )

2460-V Automatic Ball Bonder

New Equipment |  

Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.

Palomar Technologies

CBT 6000 Automatic Ball Bonder

New Equipment |  

High Speed, Large Area (12in x 6in.) Ball bonder with Continuous Bonding Technology.

Palomar Technologies

Ultrasonic Engineering   Al Wedge Wire Bonder

Ultrasonic Engineering Al Wedge Wire Bonder

New Equipment |  

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Tanaka Corporation

2470-V Automatic Wedge Bonder

New Equipment |  

Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.

Palomar Technologies

ACF Bonding

New Equipment | IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations

Microjoin

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.

Leapfrog 3D Printer

New Equipment | Printing

3D Printers  Rapid Prototyping Equipment  Semiconductor Equipment - Rework Stations - Wire Bonders -  Palomars, Orthodyne, Delvotec

CSI Equipmet Sales

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