At Advantage Plastic Products, our many years of processing experience translate to quality products manufactured to your specifications on a consistent basis. We work with many engineering and commodity grade resins including but not limited to Nylo
New Equipment | Assembly Services
Suitable for OE 7200HD,7600HD,7200 Plus machine. Specification: 5/6/8/10/12/15/16/18/20 mil OEM service available.Factory price. Contact: yoyogong@yehengdz.com
New Equipment | Rework & Repair Equipment
TFT-LCD Laser Repair Machine Support TFT-LCD LED Panel From 5′ – 80′ Including Mobile, Tablet, Laptop, Smart TV Screen. LCD Screen Resolution Support 1080P, 2K, 4K, 5K Support LCD Bad Point, Line, Block Repair Laser Head From Canada, Long Life
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip
Easy plasma evaluation for as little as €3.00 by “color.” The indicator brings simplicity to plasma evaluation. Industry first technology can realize evaluation of in-plane distribution and 3d object. Very suitable for daily plasma
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bond, Yamaha
New Equipment | Selective Soldering
Laser Selective Reflow (LSR) uses a uniform defocused laser beam over a specifically tailored area on a PCB with controlled beam intensity to implement novel soldering on specific component(or several components) while not heating up potentially the
New Equipment | Test Equipment - Bond Testers
Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, such as automatic GR&R calculation, built-in dia
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
