New SMT Equipment: bonding microelectronics (Page 1 of 2)

Microelectronics

Microelectronics

New Equipment | Assembly Services

Plexus is uniquely positioned to design and manufacture microelectronic solutions from micro-implantable medical devices and portable RF instruments to high-end infrastructure systems. Plexus engineers are focused on implementing solutions and draw u

Plexus Corporation

Chip on Board (COB)

New Equipment |  

Bonding chip and Silicone dispensing on the PCB board

Stars Microelectronics

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Microelectronics Packaging

Microelectronics Packaging

New Equipment | Assembly Services

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

New BTU Reflow Ovens

New BTU Reflow Ovens

New Equipment | Board Handling - Storage

BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing  Direct Bond Copper, Brazing, Sintering & Heat Treating  Glass-to-Metal Sealing  Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming

WittcoSales, Inc.

Henkel Electronics Assembly Film Adhesives

Henkel Electronics Assembly Film Adhesives

New Equipment | Materials

The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs. As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple appli

Henkel Electronic Materials

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

New PCB Plasma Treatment Products from Plasmatreat

New PCB Plasma Treatment Products from Plasmatreat

New Equipment | Materials

PLASMATREAT: Openair Plasma Process, Eliminating all Organic and Silicon-Based Contaminants Effectively Removes Electrostatically Attached Dust Applicable to Flat Surfaces as well as Complex 3D Shapes Atmospheric Plasma Process Reduces O

WittcoSales, Inc.

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

Permalex Edge®  SMT Printing Metal Squeegee Blades

Permalex Edge® SMT Printing Metal Squeegee Blades

New Equipment | Printing

Maximize Your Micro-Electronics Printing Results Transition's patented Universal Holder design gives you outstanding functionality, ergonomics and choices that enable you to achieve greater performance and profitability on your SMT line. Permalex E

Transition Automation, Inc.

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