New SMT Equipment: bottom heater heater (Page 1 of 25)

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

New Equipment | Reflow

Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro

Heller Industries Inc.

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

BGA Rework Machine for soldering and desoldering.  Hot Air BGA rework station for printed circuit board repair.

BGA Rework Machine for soldering and desoldering. Hot Air BGA rework station for printed circuit board repair.

New Equipment | Rework & Repair Equipment

BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla

Precision PCB Services, Inc

BGA Rework Station, Nitrogen Capable, Model E6250U

BGA Rework Station, Nitrogen Capable, Model E6250U

New Equipment | Rework & Repair Equipment

NEW!  Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b

Precision PCB Services, Inc

Nitrogen Capable SMD & BGA Rework Station Model E6250U with Cabinet

Nitrogen Capable SMD & BGA Rework Station Model E6250U with Cabinet

New Equipment | Rework & Repair Equipment

NEW!  Nitrogen Capable for High Yield Lead Free BGA Rework NEW! Movable top and bottom gas heaters. NEW!  All Shuttle Star BGA Rework Stations are now available with Cabinet Base on wheels. For high volume BGA Rework on even the largest computer a

Precision PCB Services, Inc

Nitrogen Capable BGA Rework Station. Model WDS 1250

Nitrogen Capable BGA Rework Station. Model WDS 1250

New Equipment | Rework & Repair Equipment

Large Nitrogen Capable BGA Rework Station for High Yield Lead Free BGA Rework Movable top and bottom gas heaters for large circuit boards.

Precision PCB Services, Inc

Heller 2049 MK7 SMT Reflow Oven

Heller 2049 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2049 MK7 SMT Reflow Oven Heating Zones: Top 15/ Bottom 15PCB Width:50 - 560 mmProduct description: Heller 2049 MK7 SMT Reflow Oven, Heating Zones: Top 15/ Bottom 15, PCB Width:50 - 560 mm   Heller 2049 MK7 SMT Reflow Oven Heller 2049 MK7

Qersa Technology Co.,ltd

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

Heller 1826 MK7 SMT Reflow Oven

Heller 1826 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:

Qersa Technology Co.,ltd

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