New SMT Equipment: bottom terminated components (Page 1 of 1941)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Selective Conformal Coating Systems - Tilt and Rotate

Selective Conformal Coating Systems - Tilt and Rotate

New Equipment | Coating Equipment

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Component ID Poster

Component ID Poster

New Equipment | Education/Training

BEST Inc.’scomponent ID poster is designed to be used in your training area. The poster displays  a variety of components so that instructors can teach the nomenclature or language of electronic circuit board components, The mid portion of the post

BEST Inc.

Cable and Wire Harness Assembly Class

New Equipment | Education/Training

The hands-on Cable and Wire Harness Assembly course is a comprehensive training course that will give individuals the practical hands-on experience necessary to build an entire wire harness assembly. This class is supplemental to the IPC/WHMA-A-620 C

BEST Inc.

IPC J-STD-001 Rev G Solder Training Kit

IPC J-STD-001 Rev G Solder Training Kit

New Equipment | Education/Training

BEST IPC J-STD-001 training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This training ki

BEST Inc.

J-STD-001 Training Kit for Revision F

J-STD-001 Training Kit for Revision F

New Equipment | Education/Training

BEST IPC J-STD-001 Revision F training kits feature REAL circuit boards that represent actual soldering conditions. This kit features "062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This

BEST Inc.

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