New SMT Equipment: bottom-termination components (Page 1 of 1)

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

AQUANOX® A4651US - Low pH Ultrasonic Immersion Cleaner

New Equipment | Cleaning Agents

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptionally well on the late

KYZEN Corporation

VT-X750 In-Line Automated X-Ray CT Inspection

VT-X750 In-Line Automated X-Ray CT Inspection

New Equipment | Inspection

High-speed Automated X-ray CT Inspection System The Omron VT-X750 is the perfect solution to manufacturers desiring the highest-speed, in-line, automated 3DCT X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joi

Omron Inspection Systems

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev

Process Sciences, Inc.

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bottom-termination components searches for Companies, Equipment, Machines, Suppliers & Information

Software for SMT

Wave Soldering 101 Training Course
Vacuum Reflow Soldering

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
Formic Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications