New Equipment | Wave Soldering
Maximum flexibility and performance - state of the art full tunnel nitrogen wave soldering system for demanding applications and high production volumes. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the m
New Equipment | Rework & Repair Equipment
The Hakko FX-888D is an updated digital version of the popular FX-888 and includes several new features. User selectable preset temperatures and digital calibration simplify user setup and operation, and the new password protection and low temperatur
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
New Equipment | Solder Materials
Kapp Golden Flux™ PASTE has been designed specifically for soldering Aluminum to Aluminum and Copper. Kapp Golden Flux™ PASTE stays where you put it. It is designed for use on Aluminum-to-Aluminum or Aluminum-to-Copper sheets and tabs where fluxing a
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
New Equipment | Solder Materials
900M series 900M-T-RT 900M-T-R 900M-T-K 900M-T-SI 900M-T-I 900M-T-S11 900M-T-4CF 900M-T-4C 900M-T-S10 900M-T-3CF 900M-T-3C 900M-T-2CF 900M-T-2C 900M-T-1.5CF 900M-T-1CF 900M-T-
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e
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