New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
MS-T02 Conductive bag Surface resistance:��104-106�� MS-T03 ESD lattice bag Surface resistance: ��104-106�� MS-T04 ESD and moisture-Proof vacuum packing bag Surface resistance����1011�� MS-T05 ESD PE bag Surface resistance:��1011�� MS-T
Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services fo
New Equipment | Solder Materials
Fluxes for use with Tin/Lead Solder. EQ-392 No-Clean is a homogeneous mixture of halogenfree, low solids organic flux designed for wave-soldering conventional and surface mount PCB assemblies. EQ-392 provides superior foaming characteristics with a
G 5003 - LR Ink Mixer and Defoamer (Air Bubble Remover) R&D for Best Mixing Solution: Ink for Printed Circuit Boards, AB paste and Ag (Silver) paste mixing and defoaming solution. Great use for: PCB Factory, Glass Panel Factory, Photoelectric Ind
.jpg)
Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the perf
New Equipment | Assembly Services
1.ShanXu PCBA Turnkey solution 2.PCB Assembly, PCB/PCBA Design, PCBA Copy 3.Customized PCBA/OEM/ODM/EMS(Electronics Manufacturing Service) 4.SMT&DIP&PTH&BGA Assembly 5.Component sourcing and purchasing 6.Quick PCBA prototyping 7.Test:X-Ray,AOI,
LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree
WL 66O is one part 100% solid, dual cure UV bonding adhesives, which has been designed for wafer-level lens or optical lens attachment. It can be cured by UV in a few seconds to achieve fast fixing purpose, then further cured by thermal cure to achie
In many cases the casting process is carried out under a vacuum to prevent air pockets. Trapped air bubbles reduce heat dissipation, since air is a good heat insulator, or they give rise to disruptive electrical charges in high-voltage applications,
