OEMs and EMS companies can regularly encounter problems with critical components when they discover that these are no longer available. These may be required for an imminent assembly job for which inventory and/or WIP is already building up and , to
New Equipment | Test Equipment
Inlcudes: 8510C, 8510XF, 83651B, 83621B, E7352L, & E7352R The 8510XF systems have been designed to make fully- calibrated, single-sweep measurements of broadband devices to 110 GHz, in 1.0 mm coax. By building on the 8510 network analyzer’s capabil
Overview I2C is a two-wire, bi-directional serial bus that provides a simple and efficient method of data transmission over a short distance between many devices. The DI2CM core provides an interface between a microprocessor / microcontroller and a
New Equipment | Test Equipment
High Pin Count, High Performance Tester, Non-multiplexed pin structure, In-Circuit Test, On-Board Programming, IEEE, PXI, Boundary Scan. With the continuous and fast pace of development in the electronic manufacturing the time from design to produc
New Equipment | Test Equipment
5720A Multifunction Calibrator: The lowest uncertainties of any multifunction calibrator Since its introduction in 1988, the 5700A Multifunction Calibrator has earned a worldwide reputation for performance, dependability and quality, and as a resul
NSW Automation design and manufacture fluid dispensing system and solutions. Dispensing process is achieved by various delivery method (dotting, casting, sealing, filling, jetting etc) to meet process requirements. Application range from LED, COB, Se
New Equipment | Fabrication Services
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi
Printed Circuit Board Assembly Services Through-Hole Our wave soldering and hand soldering processes are fully compliant with the highest commercial (IPC-A-610D) and military specifications. Surface Mount We use automated screen printing and pick-
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
ePlace is a newly designed software based on the Essemtec software architecture “eez-Technology”. Fingertip operation Easy to use Universal CAD input Zoom of camera windows ePlace Simplifies Complexity ePlace defines a new standard of a user
