New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Assembly Services
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
» Fully automated 200 / 300mm EFEM wafer capability » Patented vibration squeegee technology » Dual or Single load port available Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Pri
» Combined system technology (wafer printer and wafer bumper) » Unsurpassed vibration squeegee printing technology » Robust design to ensure years of dependable operation The SemiTouch Wafer Printer / Bumper is an easy to use, highly robust semi-auto
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
Through a unique design, the WS-2000 provides both bump metrology measurement and defect detection using a powerful combination of 2-D and 3-D inspection technologies.
