New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
New Equipment | Solder Paste Stencils
NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than .003 applications such as wafer bumpin
New Equipment | Board Handling - Storage
PROMATION offers a servo driven "Extend to Deliver" passageway shuttle station. The shuttle gate provides a normally open pathway (800 mm) and extends to deliver product when available. The shuttle gate uses 3 look across sensors and bump detection
New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
Minami�s Rotary Squeegee is a high precision print head with enclosed print material (solder, adhesive, etc.) allotted from inexpensive laminated plastic bags. It applies the �paste rolling formula�. Real time paste monitoring ensures the optimum amo
New Equipment | Assembly Services
PCB Assembly Quickturn and Prototype PCB Assembly. That's what you need, that's what we do. We can support small engineering projects up to full turn-key, medium volume production. With in-house process verification tools like AOI, Xray and Ersas
For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
