Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled
Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
New Equipment | Design Services
Our staff of senior level designers has extensive experience ranging from High Frequency RF, Large multi-processor, Power, Blind/Buried technology to ATE, Probe, Mix signal and beyond. At ACD the foundation of a good PCB starts with an emphasis on
| 1 |
