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NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

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Win Source Online Electronic parts

Reflow Soldering 101 Training Course
Fluid Dispensing Aerospace

Wave Soldering 101 Training Course
PCB Handling with CE

Software for SMT placement & AOI - Free Download.
Voidless Reflow Soldering

High Throughput Reflow Oven
Thermal Interface Material Dispensing

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