New Equipment | Board Handling - Storage
The basic unit for these PCB racks holds 32 boards up to 6.7" (170mm) long. Modules can be assembled side by side to hold longer Printed Circuit Cards. Standard extrusions allow card width of 0 to 10.25". For wider cards, extrusions can be cut to cus
New Equipment | Board Handling - Storage
The F9001 quick adjust PCB Rack has been developed to provide a reasonably priced easy to adjust pcb carrier as an alternative to existing high priced products. The width of the rack can be quickly adjusted for different PCB sizes by unlocking the s
PCI Mezzanine Card Carrier for CompactPCI featuring 66MHz / 64 Bit operation with full hot swap capabilities. Uses HiNT HB6 bridge with state-of-the-art specification.
PCI Mezzanine Card Carrier for CompactPCI featuring 66MHz / 64 Bit operation with full hot swap capabilities. Uses HiNT HB6 bridge with state-of-the-art specification.
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch
Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com. HDI (High Density Intrerconnection) is defined as substrate or board with the Microvia of aperture below 6mil, hole pad below 0.25mm, connect pad density above 130 points / square inch
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture print, place, reflow carriers. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
NPI design and manufacture wave solder carriers for open aperture and selective soldering process. Pallets are cut from standard glass composite (blue) or anti-static material (black). Designs can be constructed from sample card or Gerber / cad data.
World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
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