High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Board Handling - Pallets,Carriers,Fixtures
This unique full process carrier can run thru screen printing, pick & place, reflow soldering, vision inspection and X-ray inspection. The PCB can be set to the center on the y axis and flush too slightly above the top surface of the carrier for scr
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
Inline 1.2M LED Stencil Printer for PCB Board KS-1200A Feature 1. Newest image recognition system 2. Equipment with automatic adjustable width function 3. PCB position system 4.Automatically clean stencil device 5
1.2 Meter Stencil Printer with Vision KS-1200A Feature 1. Newest image recognition system 2. Equipment with automatic adjustable width function 3. PCB position system 4.Automatically clean stencil device 5.Inspect and analyze the q
New Equipment | Board Handling - Storage
Automatic Label Generation And Placement System For In-line PCB Production. PROMATION'S ELC-1100P automatic label placer is a versatile next generation system that allows for high resolution labels to be generated and placed onto circuit boards with
Odd form is optimized for handling your toughest odd-form challenges, from large through hole connectors to components up to 50 mm tall. Don't settle for anything less than unbeatable accuracy and incredible speed That is what the D-9, Assembl�on's
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
