Assembly of MCM's on laminate, flex, or ceramic
Assembly of BGA/PGA on ceramic or laminate
WEECONS® Ceramic Capacitors have long been the standard of the industry, and offer the broadest selection of available ceramic formulations and package sizes. With a capacitance range of 1 pF to .082 mF, WEECON® capacitors offer a variety of TC mater
NPO/COG ceramic chip capacitors, X7R ceramic chip capacitors, tantalum chip capacitors, capacitances from 10pF to 0.1uF
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted le
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
Improve thermal performance and long term reliability by choosing alumina or aluminum oxide (Al2O3) as a substrate material for your PCB. We can supply precise single, double and multilayer circuit boards in alumina 96 %. Contact us today to l
