Assembly of MCM's on laminate, flex, or ceramic
Assembly of BGA/PGA on ceramic or laminate
WEECONS® Ceramic Capacitors have long been the standard of the industry, and offer the broadest selection of available ceramic formulations and package sizes. With a capacitance range of 1 pF to .082 mF, WEECON® capacitors offer a variety of TC mater
NPO/COG ceramic chip capacitors, X7R ceramic chip capacitors, tantalum chip capacitors, capacitances from 10pF to 0.1uF
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted le
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
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