New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
These new ceramic versions are available in the 901, 902, 904, 906, & 925 versions. Special vacuum geometry provides excellent performance in the machine which saves you time and money during production. The machined bodies are flexible, so that they
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
We offer a wide selection of the Universal SMT Nozzles, Tooling, & Consumables. We also offer custom engineering to standard nozzles for odd shaped components. Count On Tools has been a manufacturer of high quality, low cost nozzles and associated
1000 (DF400+20C (Q=1/DF) X7R : D.F NPO Materials.; size case : 0805,1206,1210,1808,1812;===> X7R materials ; (2)Capacitor Arrays: capacitor arrays combine spearate multi-layer ceramic capacitor of hte same value in a single passive component, the pr
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted le
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
New Equipment | Assembly Services
TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
