New SMT Equipment: ceramic reflow (Page 1 of 2)

Direct Die Attachment

Direct Die Attachment

New Equipment | Assembly Services

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati

S-Bond Technologies

RD10 - Vapor Phase Reflow System

RD10 - Vapor Phase Reflow System

New Equipment |  

R&D Technical Services offers a full line of Single Vapor Reflow Systems. The RD10 provides consistent, uniform and reliable heat transfer in a Belted Inline application for high quality reflow, curing and drying. The RD10 utilizes user friendly cont

R&D Technical Services, Inc.

RD1 - Vapor Phase Reflow System

RD1 - Vapor Phase Reflow System

New Equipment |  

R&D Technical Services Inc. offers a full line of Single Vapor Batch Type Reflow Systems. The RD1 provides consistent, uniform and reliable heat transfer for high quality reflow, curing and drying. The RD1 utilizes Programmable Logic Controls coupled

R&D Technical Services, Inc.

3mm Ceramic Trimmer Capacitor

3mm Ceramic Trimmer Capacitor

New Equipment |  

Specifications: Features: Miniature and Low profile capacitor. Mountable by and automatic placer. Re-flow soldering applicable. Easy adjustment by using a conventional screw driver. Specifications: Operating Temperature Range: -25 to +85 Degre

POLY-TECH Precision Industry Ltd

Sniper Flo-master

Sniper Flo-master

New Equipment |  

The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices

A.P.E. South

Defluxing

New Equipment |  

Petroferm has the solution for removal of post reflow residues from every available solder paste and flux. Petroferm offers a complete line of aqueous, semi-aqueous, and solvent defluxing chemistries for use in every brand and style of cleaning equip

Petroferm Inc

Electronics Manufacturing

New Equipment |  

9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi

SFO Technologies Pvt Ltd

Sniper III Split Vision Rework System

Sniper III Split Vision Rework System

New Equipment |  

The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th

APE South

Printed circuit board production

Printed circuit board production

New Equipment | Assembly Services

Benefit from our versatility and experience. We manufacture rigid printed circuit boards, rigid-flex and flexible printed circuit boards [including crimp technology]. You`ll find us flexible as far as dimensions are concerned: in addition to standard

ZOLLNER ELECTRONICS, INC.

SEHO GoWave - Wave Soldering Machine for Small Production Volumes.

SEHO GoWave - Wave Soldering Machine for Small Production Volumes.

New Equipment | Wave Soldering

The ideal system for entry into automated wave soldering and small production volumes. Compact... but with technology of a high-end system. The GoWave is a powerful soldering system for those just entering into mass-soldering operations.  This sy

SEHO Systems GmbH

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