New SMT Equipment: cfm requirment (Page 5 of 107)

IPC J-STD-001F Standard

IPC J-STD-001F Standard

New Equipment | Education/Training

IPC J-STD 001 REV F Requirements for Soldered Electrical and Electronic Assemblies.  The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released August 2014. IPC J-STD-001

BEST Inc.

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

Board Repair Kit

Board Repair Kit

New Equipment | Rework & Repair Equipment

Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of

BEST Inc.

IPC-A-610G Standard

IPC-A-610G Standard

New Equipment | Education/Training

IPC A-610G Acceptability of Electronic Assemblies. The 610 is the industry standard for the acceptance criteria for assembled PCBs. It is also the instructional book used when teaching IPC-A610 CIS students. Revision G has lots of new photos and i

BEST Inc.

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Wipes

New Equipment |  

Used on SMT machinery where Under Stencil Rolls are not required. Available in Polyester Cellulose material, clean room processed and packaged if required.

Edson Electronics Ltd

Custom Jigs

New Equipment |  

Unique applications requiring precision jigs. For Testing, Assembly and parts preparation

AXYSS Corporation

Custom designed cabinets

New Equipment |  

Storage cabinets to meet specific customer requirements.

Aerofeed Inc.

Transformers

New Equipment |  

Custom units built or designed for a customers special requirements.

Galaxy Transformer and Magnetics, LLC


cfm requirment searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Blackfox IPC Training & Certification

High Throughput Reflow Oven
SMTAI 2024 - SMTA International

World's Best Reflow Oven Customizable for Unique Applications