Realizes the Highest Placement Speed Among Chip Shooters of the Same Class by Adopting a New Flying Head Mechanism Equipped With 10 Spindles. As a high performance chip shooter that applies two gantries equipped with 10 spindles per head as well as
Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
New Equipment | Cable & Wire Harness Equipment
Overview The SealCrimp 210 B is a highly flexible benchtop machine for stripping, sealing and crimping a great variety of different wire sizes up to 2.5 mm² (14 AWG). The machine can process a great variety of crimp terminals and seal types includin
New Equipment | Test Equipment
Press-Down-Unit (PDU) Fixturing system provides lowest cost interface. Combining Economics & Quality in PCB Test Non-Multiplexed to 3,456 pins One Touch Fixture Interface provides fastest change-over times (1,400 nets) Fast Test Program Gene
Thanks to the resources and track record of the Paragon Electronics Group, Vigilant can provide its customers with the industry leading Total Component Management™ (TCM®) electronic component kitting services. Uniting our core skills of electronic co
New Equipment | Test Equipment
Xynetics 1034X Die Prober Test Station with Olympus Microscope head. The eye pieces are Olympus G20x 12.2. We are unable to test this prober. Cables for the controller to connect to the probe station are not available. Contact for freight shipping de
New Equipment | Education/Training
Thermography is use in a broad range of applications. Thermography is used routinely for NDT, PPM, PdM and Condition Monitoring for electrical and mechanical systems, buildings and roofs, boilers and steam systems, and process equipment. Become a C
Inspection of low, medium & high volume surface mount & thru hole technology. AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with the
New Equipment | Wave Soldering
Maximizes Yields and Reduces Rework The ECD Fluxometer® maximizes yields and reduces rework by qualifying your spray fluxer pattern uniformity and top-side-penetration. Improve Process Quality - Eliminate guesswork when it comes to managing the c
