SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
This module contains all SMT Plus Inc. standard components in EPD/AutoCAD library form. Visual and parametric libraries are provided. Just point and select a desired component from the hundreds of parts available and insert it into your layout drawi
New Equipment | Solder Materials
The Xytronic LF-8800A 5 Tool Lead Free SMT Workstation, with an internal vacuum pump is XYtronic-USA’s best solution for all your soldering/desoldering equipment needs, especially for lead free applications! We believe you will be more than satisfied
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Straight shank acc. DIN 6535 HA without clamping flat Design Features- 2-fluted/ 4-fluted right-hand spiral 30 degrees, right hand grinding, centre cutting upto diameter 3mm, from dia 4mm 1 tooth above centre Applications- For slot milling and profil
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Overview • executes up to 200 million instructions per second • more than 15 times faster than 80C51 • ultimate power/performance ratio The DP80390XP is an ultra high performance, speed optimized soft core of a single-chip 8-bit embedded controll
Overview • pipelined RISC architecture • more than 15. times faster than 80C51 • up to 14.632 VAX MIPS at 100 MHz The DP80390CPU is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controller, intended t
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