The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
A wide work scope range : able to handle large PCBs 50x50 mm 530x460mm. Variable component placement ability 0603mm (0201 inch)chips, QFP,BGA,CSP, odd-form parts Four high-speed precision head-based operation Can handle up to four - 18mm parts at
As a general component placer whose vision system is reinforced based on the platform of the SM471 high speed chip shooter and whose chip placement speed is the highest among the same class component placers, the SM481 realized achip placement speed
Achieving industry's top levels of mounting speed and productivity per area of factory floor space. Yamaha Motor Co., Ltd. has developed the new high-density modular surface mounter(*1) model "YSM40" Adopting a 4-beam, 4-head layout on a compact pl
The DECAN F2 next-generation high-speed universal chip mounter, provides the highest productivity and mounting precision in it class. Best in class productivity The DECAN F2 next-generation high-speed universal chip mounter, provides the highest pr
KE-3020V represents the latest leading-edge technology for improved flexibility and production quality. Higher Speed, Higher Quality, Improved Capacity. The KE302V is a 7th generation modular placement machine from Juki and represents the latest lea
| 1 |
