New Equipment | Rework & Repair Equipment
Finally! A High End BGA Rework System at an affordable price. Fits board up to 25" Places components from 4mm to 50mm Standard resolution Split Vision Assist for Component Alignment Plug and Play. Fully self contained with is own internal air
New Equipment | Assembly Services
introduction: ZH series is a fully automatic SMT placement machine, it can be mounted various of component through a vacuum nozzle, it is currently on the market cost-effective automatic placement equipment. The machine is suitable for most of the
TAB Excise Tooling. This tooling will excise 35, 48 and 70mm TAB devices to Customers Specifications. The Tooling is Self-Aligning and Quick Change. And will fit into any of our Vertical Access Presses.
TAB Excise and Form Tooling. This tooling will excise and form TAB devices to customers specifications. This tooling is self aligning and quick change and will fit into any of our Vertical Access Presses. This tooling incorporates a keeper bar cla
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th
The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
