New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 Our product can cut the board with the led chip no damage and no bend. After extensive tests of the separation process a lot of automobile suppliers use exclusively the depan
Product ID WSTM-MCTest-002 Model No. Communication module's functional test fixture Patent No. keyword index Test fixture for stamp hole, FCT test fixture for 3G
New Equipment | Test Equipment
Product ID WSTM-IC Test-004 Model No. BGA IC test jig for access controller Patent No. keyword index BGA test fixture, IC test jig, IC test pallet, IC test jig fo
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Rework & Repair Equipment
2016 hot collection WDS-700 automatic iphone glued chip rework station with HD camera WDS-700 bga rework station video: https://youtu.be/pmHfF48dRrY Independent 2 heating zones temperature control system Up-heater power: 1200W Down-heater power: 1
Device control via internal JTAG access - processor and FPGA cores While many ICs are equipped with a JTAG (IEEE Std. 1149.1) boundary-scan register (BSR), a significant number of microprocessors and DSPs can be found with deficient or even non-exi
New Equipment | Test Equipment - Bond Testers
For Wire and Die Testing on Royce and Dage tester
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