New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
Device control via internal JTAG access - processor and FPGA cores While many ICs are equipped with a JTAG (IEEE Std. 1149.1) boundary-scan register (BSR), a significant number of microprocessors and DSPs can be found with deficient or even non-exi
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
ChipVORX is a new in-system technology for the configuration and control of chip embedded test, debug, and programming functions In its core ChipVORX is based on the utilization of a new communication interface in the software platform SYSTEM CASCON
New Equipment | Test Equipment
Application Computer Control Electro-Hydraulic Servo Universal Testing Machine is suitable to test various metallic & non-metallic materials for tension, compression, bending and shearing strength. It can be capable of testing the characters of mate
Fine Line Stencil's unique Slic Blade™ process uses electroformed nickel to form a hard, very smooth surface with extremely low surface energy (high lubricity). Solder paste readily sticks to most metal surfaces, even coated blades, due to metal's hi
The ABI ChipMaster Compact Professional is a low-cost, hand-held out-of-circuit IC tester. The ChipMaster is designed for testing digital ICs with up to 40 pins through a ZIF socket (see LinearMaster for analogue devices). A range of adapters is also
Standard Printed Circuit Boards custom manufactured over 1,000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the Telecom/IT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250° Ce
The art of combination. . . the essence of thin film technology. Since 1980 Thin Film Technology has been designing and manufacturing thin film components in an ISO9001 certified operation. From this factory quality product serving the computer, test
Tessent combines features of deterministic scan testing, embedded pattern compression, built-in self test, specialized embedded memory test and repair, and boundary scan, as well as board and system-level test technologies. The Tessent product suit
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