PCB cutting machine/PCB depaneling machine/PCB separator ASC-700 model from ASCEN technology co.,ltd The more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This mac
The more detail and video please check the link: www.pcb-separator.com This machine specializing the LED aluminum board. and very popular in Europe .It can cut the board with the led chip no damage and no bend. Our SMT automation equipment
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It use the Europe quality standard and different from our other
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It can cut the board with the led chip no damage and no bend. W
New Equipment | Education/Training
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be use
SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used a
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
