New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
New Equipment | Solder Paste Stencils
MET Stencil announces a new sprayed on baked on coating called NanoSlic Gold. We are currently offering a no charge sample to all of our new, and existing customers. Using advanced polymer chemistry, this coating has been developed to address the inc
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
New Equipment | ESD Control Supplies
High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi
New Equipment | Rework & Repair Equipment
The TMT-TC-2 Tip Tinners is a compressed tablet of pure tin and ammonia phosphate formulation in a metal container with lid. It has a self adhesive pad on the underside to allow it to be affixed on, or near the work station. Removes tip oxidation
A Revolutionary Print Solution with Integrated Post Print AOI The VERSAPRINT series not only handles the automatic cleaning of the underside of the stencil and inspection of the printing result, with a choice of 2D or 3D inspection, it also carries
Applicable to large size PCB L510 × W460. Ideal printing condition by 3S head.(3S: Swing Single Squeegee) High speed printing ability: Line tact 11.0 sec. Capable of fine adjustment for printing alignment parameter by Graphical layer base
New Equipment | Solder Materials
The TMT-TC-2 Tip Tinners is a compressed tablet of pure tin and ammonia phosphate formulation in a metal container with lid. It has a self adhesive pad on the underside to allow it to be affixed on, or near the work station. Removes tip oxidation
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
