New Equipment | Curing Equipment
Fully automated, electric-powered, bubble-free oven for inline, mass production ECO99C is fully automated, electric-powered convection, selective heating oven which controls the temperature precisely and proportionally by SCR unit within a range of
New Equipment | Curing Equipment
Designed for Conformal Coatings and other Curing applications. LEL Protection. High Solvents, High Solids, Humidity Curing. High Volume Production. Large Area Filters. Reel to Reel Foil Drip liner and removable drip pans for easy maintenance. Convect
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
In many cases the casting process is carried out under a vacuum to prevent air pockets. Trapped air bubbles reduce heat dissipation, since air is a good heat insulator, or they give rise to disruptive electrical charges in high-voltage applications,
YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularl
New Equipment | Cleaning Equipment
Maximize your stencil cleaning results! AKS Stencil Cleaner provides microscopic, ultrasonic removal of solder paste and post-solder flux buildup. All-in-one cleaning All “workstations” included in one compact unit, minimizing required floorspace.
Inline High Precision CCD fiducial Visual Dispensing Machine This is an inline dispensing machine, connecting other machines at the front and in the back via a conveyor, and communication signals (e.g. SMEMA). Working as an automatic assembly line,
About 2 part silicone Metering, Mixing and Dispensing System The 2 part silicone Metering, Mixing and Dispensing System accurately meters, mixes and dispenses two-component materials like potting compounds, encapsulants, casting materials and adhesi
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