Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Bonding chip and Silicone dispensing on the PCB board
New Equipment | Board Handling - Storage
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole
Layer: Single-Sided Price：USD275.50 Quantity :3Panel Min Holes：2.00mm surface Treatment:ENIG solder mask:White silk screen : Black Board Thickness: 1.6mm Cu Thickness: 35um Aluminium Model: 5052 Thermal Conductivity: 150W/m. K Breakdown Voltage:
Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets
Core Competency: - Total customer satisfaction - Quality components - Meticulous quality assurance - Timely delivery Capabilities: - SMT - COB - BGA - Plastic - Metal Services: - OEM contract manufacturer - Electronics Manufacturing Service prov
Our LCDs are manufactured using COG (Chip On Glass), COB (Chip On Board), TAB (Tape Array Bonding) and COF (Chip On Flex) technology. From small graphic units suitable for cell phones to character modules for industrial use to larger TFTs (Thin Film
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