New Equipment | Coating Equipment
Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000. SimpleCoat basic model without tilt and rotate
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
New Equipment | Assembly Services
SMT Xtra provides a full range of original or high quality replacement Spare Parts, Nozzles and Consumables for... SMT Placement Machines. SMT Screen Printers. SMT Dispensers. All of our Spare Parts, Nozzles and Consumables are qualit
New Equipment | Test Equipment
Have a product that you need tested and configured to end-user requirements? Accu-sembly makes it easy for you by providing this service right on the production floor! Your assemblies straight from our floor to the testing department makes one less s
OMG offers the Microbond brand of printing and dispensing solder pastes. Available in a wide range of alloys and WS, RM and NC vehicle systems.
Panasonics, Sanyo,Yamaha,Fuji,Juki,Sony, Universal,Samsung,etc.
New Equipment | Coating Equipment
DC Series – Conformal Coat Dip Systems (Lab, Bench-top, In-line) SB Series – Conformal Coat Spray Booth Systems CR Series – Conformal Coat Removal Systems G3 Dispensing - Automatic Robotic – liquids, pastes or gels
25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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