Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Model CWDJ-300 CWDJ-400 CWDJ-500 Working Area/mm 300(X)*300(Y)*100(Z) 400(X)*400(Y)*100(Z) 500(X)*500(Y)*100(Z) Size/mm 490(L)*528(W)*679(H
Application Chevrons, fridge magnets, key chains, power supply, cell phone, energy saving light, LED, DVD, DC, Switch, Connector, relay and other industries needing fluid glue solder. Applicable objects: Mobile phones, computer case, CD-ROM drive
Feature 1. Full automatic robot with 3 or 4 axes. 2. Dispensing path can be set in the robot or imported from out computer. 3. Easy operation, the holder and program easy to amend. 4. Can store multiple independent running program. 5. High pre
Bonding chip and Silicone dispensing on the PCB board
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
1. The machine Special design for the IC sealing technical. 2. Heating temperature control device with Japan. Keep the temperature between dispensing end and basic board. Tolerance +/-1�� 3. Directly take the COB black glue into the tank, pick-a
NSW Automation design and manufacture fluid dispensing system and solutions. Dispensing process is achieved by various delivery method (dotting, casting, sealing, filling, jetting etc) to meet process requirements. Application range from LED, COB, Se
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
