Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
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