New SMT Equipment: coin socket solder (Page 1 of 2)

Harwin EZ-Boardware PCB Components

Harwin EZ-Boardware PCB Components

New Equipment | Components

EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis

HARWIN

Test Sockets

New Equipment |  

Our sockets are available in a variety of termination styles including wire wrap, round pin, solder cup, wire crimp and a 1mm diameter round tail for plug connectors.

QA Technology Company, Inc.

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

Grypper - High Performance BGA Socket

Grypper - High Performance BGA Socket

New Equipment |  

One PCB design for test and production. Design your PCBs without socket mounting holes or hardware considerations and eliminate the need for a special test socket footprint. Grypper provides excellent signal integrity for today's high-frequency appli

Cascade Microtech, Inc.

Prototyping Adapters

Prototyping Adapters

New Equipment |  

Accept a device and either plug into an EPROM emulator or production socket or solder down to a land pattern. Available for DIP, PLCC, SOIC and QFP packages.

Logical Systems Corp

Production Adapters

Production Adapters

New Equipment |  

Plug into a DIP socket and provide a land pattern for soldering down an SOIC or SSOP device. Use to replace unavailable packages.

Logical Systems Corp

Harwin PCB Terminals and Hardware

Harwin PCB Terminals and Hardware

New Equipment | Components

Terminals Harwin Terminals are useful for a variety of connection styles and location requirements. Choice of turned and blade designs. Solder and wire-wrap location points. Test points. Single male contact for use with applicable

HARWIN

MaxTC High Power Temperature Forcing System From -65⁰C to +175⁰C / 200⁰C

MaxTC High Power Temperature Forcing System From -65⁰C to +175⁰C / 200⁰C

New Equipment | Test Equipment

https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/  High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates

Mechanical Devices

EVS Solder Recovery Systems

EVS Solder Recovery Systems

New Equipment | Wave Soldering

Solder Recovery System Turns Dross into Dollars. The Solder Recovery System enables PCB manufacturers to recycle solder onsite directly from their wave solder machines. The EVS by Sono-Tek solder recycling system saves up to 50% in solder costs in

EVS International

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

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