Formed parts are used for electrical insulation, such as snap-in-place housings, protection of high voltage parts, or covering bus bars. Plastics Forming Methods: Heated line bending Press brake cold forming Perforating for bend in plac
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
The high-performance device for industrial use. Easily integrated thanks to small size and low weight. Also easy to use. Various nozzle geometries provide flexibility in use.
The low-cost plasma handset for flexible and versatile use. Use in workshops, laboratories or during repair operations in the field. Extremely easy to operate using the plug & play principle.
Supply seamless steel pipe 1. Outer Diameter: Hot finish: 400 – 1020mm, Cold drawn:3.72 – 457mm 2. Wall Thickness: Hot finish: 16 – 200mm, Cold drawn: 1.7 – 22.5mm 3. Standard: ASTM A106, ASTM A53, ASTM A179, API5L GR.B, X42, X46, X52, 4. Lengt
Supply seamless steel pipe 1. Outer Diameter: Hot finish: 400 – 1020mm,? Cold drawn:3.72 – 457mm 2. Wall Thickness: Hot finish: 16 – 200mm,? Cold drawn: 1.7 – 22.5mm 3. Standard: ASTM A106, ASTM A53, ASTM A179, API5L GR.B, X42, X46, X52, 4. Lengt
- Super-thin surface emission panel (as thin as 0.2mm), low space needs, can be pasted, solid cold light source, low power consumption, Long life, Multi-color available, OEM designs are welcome. - Application: back-light of phone, PDA, MP3 machine,
- Super-thin surface emission panel (as thin as 0.2mm), low space needs, can be pasted, solid cold light source, low power consumption, Long life, Multi-color available, OEM designs are welcome. - Application: back-light of phone, PDA, MP3 machine,
a cooling preparation used to find failures with thermal method, provides quick cooling down to the temperature of �67�C, by proper usage it allows us to locally cool down assemblies, the preparation is perfectly suitable for finding �cold solderings
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S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with