New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
Includes: 100mm Chuck, Signatone XXC5S/LDC1 Probe Station #XXC5S-NOV, Signatone S-400 Controller, Signatone SA-Zoom, Signatone X/Y Axis Controller XXC5T-NOV, Signatone S-96MW Micropositioner, Kinetic System Vibraplane Table, Ready Lamp ELC-15 Light S
The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
1661D89G01 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 115VAC 2 1661D89G02 Power Supply MMI P/S (old version) w/ AC/DC RT301-2 brick and 3MSC7 7380A31G01 card 230VAC 2 1661D89G03 Power Supply MMI P/S (old versi
1A54252G02 1A54289G06 1A57252G02 1A57288G06 1B30016H06 1B30023H01 1B30023H02 1B30035H01 1B30047G01 1C31036H03 1C31051G01 1C31051G02 1C31107G01 1C31107G02 1C31110G01 1C31110G02 1C31110G03 1C31113G01 1C31113G02 1C31113G03 1C31113G04 1C31113G05 1C31113
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