New SMT Equipment: cold solder soak time (Page 1 of 3)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

Profile Planner - Reflow Profiling Software

Profile Planner - Reflow Profiling Software

New Equipment | Software

Match Solder Paste Specifications and Oven Configurations to Provide Robust Process Profiles... The Profile Planner is an Microsoft® Excel Workbook Application that allows you to match Solder Paste specifications and Oven specifications. You can the

Electronic Controls Design Inc. (ECD)

RE-7500

RE-7500

New Equipment | Printing

- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking

Jovy Systems Limited

Henkel Loctite GC 10 - The Game Changer

Henkel Loctite GC 10 - The Game Changer

New Equipment | Solder Materials

16 hours), and abandon time (>8 hours) Improved paste transfer efficiency Printing: Suitable for high speed printing up to 125 mms-1 Improved reflow process window (high soak temperatures and time) with superior coalescence and wetting Very shiny

Blue Thunder Technologies, Inc.

KIC 24/7 Wave - Wave Solder Process Software

KIC 24/7 Wave - Wave Solder Process Software

New Equipment | Wave Soldering

Automatic Profiling, SPC and Traceability for Wave Solder The KIC 24/7 Wave brings an innovative level of automation to the wave solder process: around-the-clock monitoring, SPC charting, analysis, documentation, and production traceability - ALL in

KIC Thermal

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

ERSA ECOCELL Selective Soldering Machine

ERSA ECOCELL Selective Soldering Machine

New Equipment | Selective Soldering

Predestined for production in manufacturing islands   With the Ersa ECOCELL, the worldwide technology leader in selective soldering systems expands his product range with a system that fully responds to the demands of modern production methods.

kurtz ersa Corporation

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

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