1. Parts List I. Hardware SPINDLE KAVO spindle CCD Sony 520 line industrial cameras LENS Computar EX2C Screw TBI Precision ground ball screw imports Guide HIWIN widening Impor
Application Chevrons, fridge magnets, key chains, power supply, cell phone, energy saving light, LED, DVD, DC, Switch, Connector, relay and other industries needing fluid glue solder. Applicable objects: Mobile phones, computer case, CD-ROM drive
Automatic Dispensing Machine Glue Dispenser Robot For Electronic Factory Working Principle: Putting 50ml package hot melt adhesive into specific heater, using dispensing controller to extrude glue and 3-axis robot to complete dispensing path. F
Ground EMI filter model GLE30-1 blocks high- frequency noise (EMI) on ground while providing while maintaining very low impedance for electrical safety. The filter is very easy to connect and it requires no maintenance. One of the most common appli
New Equipment | Cleaning Agents
AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in multi-p
New Equipment | Cleaning Agents
AQUANOX® XJN-PLUS is a KYZEN legacy product. The aqueous cleaning solution is effective on pastes, fluxes, and assembly residues. AQUANOX® XJN-PLUS is a multi-metal safe product with no sump-side adds and leaves solder joints brilliant. Mu
PGB-200 Dispensing machine equipment for epoxy resin filling machine AB component glue potting machine epoxy application Product Description Machine specification: 2 Part Epoxy Resin Encapsulated Transformer Potting Filling Mixing Dispenser AB Gl
New Equipment | Cable & Wire Harness Equipment
Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line w
New Equipment | Cable & Wire Harness Equipment
Overview The SawPolish Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections. Three models for sawing and polishing a wide range of crimp connections Polishing disc is in line w
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
