Be adequated to applicated in connection with PC enclosure for grounding function. - notebook - server - desktop - RAID Structure : material : BeCu,Phosphor Bronze electroplated : naked,Au,Ni,Zn Fixed type : - Rivet Mount - Thread type Mount -
> ◇Precise mechanical structure and controlling unit ensure stable operation and low noise. ◇Unique design of RGB(Red-Green-Blue) three color LED light can detect the NG point of the PCB ◇High resolution CCD cameras with 0201 component and 0.3m
New Equipment | Assembly Services
> ◇Precise mechanical structure and controlling unit ensure stable operation and low noise. ◇Unique design of RGB(Red-Green-Blue) three color LED light can detect the NG point of the PCB ◇High resolution CCD cameras with 0201 component and 0.3m
Screen Printer NPS510E Printer with emphasized simplicity and economic efficiency •±12.5㎛ high-accuracy alignment •Rigid structure of Stage and Vision unit •Conveyor formation according to customer requirements - Possible for 3 step buffer conv
e*ECAD provides EDA tools from both established and emerging companies with a variety of licensing options including pay-per-hour tool rental and subscription licensing. By offering a broad range of tools for creating tool flows e*ECAD decreases IC
NCI uses the latest generation PCs, with standard office software (including spreadsheet, database, program management and word-processing software) for normal office operations and program control. We (and our consultants) use Pro-E engineering and
PE Foam Improved packaging against shock and vibration Suitable for lining shipping cartons Protection from moisture and dust due to its closed cell structure No carbon or metal particles and non-corrosive Durable, resilient, attractive
New Equipment | Assembly Services
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
New Equipment | Assembly Services
Integrating your design into our processes is a critical element of producing a quality product. Our project managers and engineering teams are well trained to review and verify gerber data for accuracy based on customer design specifications. With m