New SMT Equipment: compensation (Page 1 of 160)

Real Time Process Control for Uniform Fluid Dispensing

Real Time Process Control for Uniform Fluid Dispensing

New Equipment | Dispensing

Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b

GPD Global

Jetting Pump - NCM5000

Jetting Pump - NCM5000

New Equipment | Dispensing

Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design

GPD Global

Volumetric Pump - PCD

Volumetric Pump - PCD

New Equipment | Dispensing

Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

Surface Mount Soldering F8

Surface Mount Soldering F8

New Equipment | Reflow

Surface Mount Soldering F8 Surface Mount Soldering Heating zones: 8 Heating method: Hot Air Usage: SMT Assembly line Product description: Surface Mount Soldering, Heating zones: 8, Heating method: Hot Air, Dimension(L*W*H) 5000*1320*1490mm Wei

Flason Electronic Co.,limited

Automatic Glue Dispensing Machine for PCB

Automatic Glue Dispensing Machine for PCB

New Equipment | Depaneling

I.C.T High Precision SMT PCB Dispensing Machine ❙ Introdution : Introduction:  As functionality and performance increase in the electronics field, there is an increasing need for finer and more precise coatings. The HD series machine is a micro-

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T- AI-5146 | SMT Production Line Online AOI Inspection Machine

I.C.T- AI-5146 | SMT Production Line Online AOI Inspection Machine

New Equipment | Inspection

I.C.T- AI-5146 | SMT Production Line Online AOI Inspection Machine Overview On Line AOI-AI-5416 Introduction: I.C.T SMT AOI captures board image in real time by high precision color industrial camera. Adopt Convolutional Neural Network (CN

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Koh Young ZENITH Alpha UHS 3D AOI

Koh Young ZENITH Alpha UHS 3D AOI

New Equipment | Test Equipment

Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33

Qersa Technology Co.,ltd

Koh Young ZENITH Alpha HS 3D AOI

Koh Young ZENITH Alpha HS 3D AOI

New Equipment | Test Equipment

Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m

Qersa Technology Co.,ltd

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