Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Photonic Products Ltd, the UK optoelectronics device manufacturer and laser diode specialist, has launched a 25mW version of their hugely popular 405nm (blue-violet) Photon laser diode modules with TTL modulation. The 25mW output power offered by th
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