CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Schematic Capture, Circuit Board Layout and Design, CAD File Conversion, Circuit Board Assembly, Surface Mounted Components, Cables and Harnesses, Box Builds, BGA and Finepitch Component Assembly and Rework, X-ray Inspection.
Lean manufacturing, factory floor layout, machinery evaluations, materials management, software selection & installation, workcell design, statistical process control, design of experiments
Full design service - from concept to production. Hardware, embedded software, board layout, assembly and test. PCI, cPCI, IndustryPack, PMC, VME, PCMIP etc. http://www.dyneng.com
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Analog, Digital and RF circuit design, PCB layout services and Embedded Software implementation.
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
