New SMT Equipment: component induced bow (Page 1 of 4)

PCB Laser Depaneling Services

PCB Laser Depaneling Services

New Equipment | Depaneling

If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu

BEST Inc.

PB RainBow� Hex Key L-wrench

PB RainBow� Hex Key L-wrench

New Equipment |  

The time when tools are grey and boring is OVER! The attractive coating of the RainBow� hex key L-wrench not only brings colour to the workplace. The colour coding according to size enables the quick grabbing of the right tool. The noticeable colour

PB Swiss Tools (US Distributor)

SMT 158 Capillary Underfill

SMT 158 Capillary Underfill

New Equipment | Materials

Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package

YINCAE Advanced Materials, LLC.

Pneumatic PCB Depanelizer 2

Pneumatic PCB Depanelizer 2

New Equipment | Depaneling

Pneumatic Pcb Depanelizer For Pcb Assembly, 1. Operator foolproof! Panels cannot be inserted into the knives except on the score line 2. Shears boards safely with parts as close as 0.5mm to the score line, including ceramic capacitors 3. Motorized

HuiKe Tech

Low Cost Double-Side PCB Prototype huanyupcb.com

Low Cost Double-Side PCB Prototype huanyupcb.com

New Equipment | Prototyping

Quickturn PCB quote please sent E-mail to quotes@huanyupcb.com.  ItemCapability Production TypeAlum PCB/Multilayer PCB 1-14L LaminationFR4. CEM-3. Halogen Free PCB ThicknessInner layer: min 0.1mm         outer layer: 0.2-3.2mm Copper ThicknessH/

PCB Manufacturer HuanYu Technologies Co., Ltd.

Double-sided Prototype PCB huanyupcb.com

Double-sided Prototype PCB huanyupcb.com

New Equipment | Prototyping

Item    Capability Number of Layers    2 layer Quantity :3Panel Material    FR4 PCB Thickness    1.6mm Copper Thickness    1/1 OZ                                                                    Max Finish size    580X610mm Min. Hole size    Min: 0

PCB Manufacturer HuanYu Technologies Co., Ltd.

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us

Akrometrix

New Series of Benchtop IC Temperature Test Systems

New Series of Benchtop IC Temperature Test Systems

New Equipment | Test Equipment

The Temptronic® ThermoSpot® benchtop systems for temperature testing integrated circuits including high-Watt emitting devices.  It consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible um

inTEST Thermal Solutions

PS-900-SOLAR Solar Soldering System - Tip Hand-piece

PS-900-SOLAR Solar Soldering System - Tip Hand-piece

New Equipment | Rework & Repair Equipment

The need to reduce PV manufacturing costs combined with the present shortage of polysilicon feedstock are driving a steady reduction in wafer and cell thicknesses. The PS-900-Solar Soldering System is the perfect solution Soldering of wires (tabs and

Metcal

TherMoiré® PS200S - Thermal Warpage and Strain Measurement Tool

TherMoiré® PS200S - Thermal Warpage and Strain Measurement Tool

New Equipment | Test Equipment

The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap

Akrometrix

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