High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
2.0 Cmk @ ± 25 μmProduct description: DEK E Seriels SMT Stencil Printer E by DEK, core cycle time: 8 seconds, Substrate size: 620 mm (X) x 508.5 mm (Y), System alignment capability: > 2.0 Cmk @ ± 25 μm DEK E SMT Stencil Printer DEK E SMT Stenc
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with etched areas. When huge open spaces have to be produced on the bottom side of a stencil, the etching technology is one opportunity to realize it. The apertures for the solder paste print process are still manuf
New Equipment | ESD Control Supplies
High humidity is known to cause problems with electronic parts and components, however compliance with RoHS standards has raised awareness of moisture issues and seen a huge increase in the use of moisture barrier bags. Barrier Bags Use of unleaded
Absolutely economic LEAD FREE REFLOW OVEN. Specially designed for the Medium quantity requirement. Advanced Mechanical System a) Adopting forced air convection, hot air spray to PCB well-proportioned under the work of static press.The landscape o
Solder flow by electromagnetic. It flow evenness steadily, almost non-oxidation. Titanium alloy solder bath: suitable for lead-free solder. Adopted the strengthen soakage spout can greatly reduce the SMT element soldering defect. Motorized mechan
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
Waffletechnology� cleaning cards incorporate flexible, raised platforms on their top and bottom surfaces. These cleaning platforms are essentially spring-loaded, significantly increasing the pressure applied to the internal components as the card pas
