1. HTCC Ceramic Feedthrus 2. High Frequency Design, upto 10Ghz ideal for high speed devices 3. Enhanced thermal conductivity, ideal for TEC installation 4. DWDM, WWDM, WDM, EDFA, tunable laser, EA, SOA, and CW Optical Packages for the industries of
A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora
A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor
KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics. Our capacitors are fundamental elements used in every type of electr
Material: Aluminium Layer Coverage: 1Layer Thickness: 1.6mm Surface Technique: HAL Line Width/Space: Solder Mask Color: Black silk screen:white We sincerely hope to establish longtime and friendly business relationship with you. Good quality, re
Material: CEM-1 Layer: 1 Thickness: 0.8mm Surface treating: Pb free HAL Solder mask: Green Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Sample 3 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test We are always
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
New Equipment | Surface Finish
The Phantom RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design bui
8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2
